SK Nexilis
SK nexilis leads
display parts industry
with cutting edge technologies
the development of a technology that transcends generations
The overwhelming experience of display starts from the fine pitch that enables high resolution.
With our technology of making the thinnest FCCL of 0.3–13 ㎛, SK nexilis is contributing to the design of ultra fine circuits under the pitch of 20 ㎛, which enables ultra high-resolution display products.
SK nexilis is leading us towards the 5G era with sputter-type FCCL that minimizes loss of signals ncessary for 5G communication devices
Through various efforts from new low-k materials development to the research of various customer-tailored recipes, we continuously engage in R&D activities to come up with the highest-quality technology in order to improve the process efficiency of our customers.
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18µm
Pitch
Handling ultrafine pitch -
2~13µm
Thickness
Covering Various Cu thickness -
12.5~50>
Dimensional Stability
Superior dimensional stability
Product Preview
Highly-reliable, sputter-type FCCL,
the core material for chip on film (COF) displays
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The Key Material for the display industry
Widely used in display materials as an indispensable key electronic material. -
Quality Control and Technology Development
We are striving to develop quality control
and prior technology required by the
display industry. -
Thin & Reliable FCCL
We offer thinner, more reliable
products to our customers -
PI Film Thickness
25 ~ 38µm
2-metal FCCL for semi-additives
for flexible mobile displays and 5G communication devices
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The Key material for the display industry
Widely used in mobile display materials
as an indispensable key electronic
material. -
OLED Mobile Display
It is used as an element of 2-metal
COF that delivers high-resolution
image signals. -
2.5x image signal implementation
We provide materials that can
implement 2.5 times more image
signal compared to 1-metal COF. -
PI Film Thickness
25 ~ 50µm
Manufacturing Process
Sputtering
Sputtering forms tiecoat layer
and copper seed layer
Manufacturing Process
Electro-plating
Electroplated copper layer is formed,
and the copper layer is used in COF.
This helps to improve customer yield
by minimizing surface defects
Manufacturing Process
Laminating &
Slitting
Stiffeners are attached to facilitate handling
during the customer's process.
Cut to the width desired by the customer
Contact us
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